CTLSH01-30L TR PBFREE

CTLSH01-30L w w w. c e n t r a l s e m i . c o m SURFACE MOUNT SILICON LOW VF SCHOTTKY DIODE DESCRIPTION: The CENTRAL SEMICONDUCTOR CTLSH01-30L is a high quality Schottky diode designed for applications where ultra small size and low forward voltage are prime requirements. This component provides performance characteristics suitable for the most demanding size constrained applications. MARKING CODE: D TLM2D3D6 CASE APPLICATIONS: FEATURES: • DC-DC Converters • Voltage Clamping • Protection Circuits • Battery powered applications including Cell Phones, Digital Cameras, Pagers, PDAs, Laptop Computers, etc. • Current (IO=100mA) • Low Forward Voltage Drop (VF=300mV TYP @ 10mA) • Low Reverse Current (1.3μA TYP @ 10V) • Ultra Small, Ultra Low Profile 0.3mm x 0.6mm x 0.3mm Leadless Surface Mount package MAXIMUM RATINGS: (TA=25°C) Peak Repetitive Reverse Voltage SYMBOL VRRM 30 UNITS V DC Blocking Voltage VR 30 V Average Forward Current IO 100 mA IFSM 500 mA Peak Forward Surge Current, tp=8.3ms Power Dissipation PD 100 mW Operating Junction Temperature TJ -65 to +125 °C Storage Temperature Tstg -65 to +150 °C Thermal Resistance ΘJA 1000 °C/W ELECTRICAL SYMBOL IR CHARACTERISTICS: (TA=25°C unless otherwise noted) TEST CONDITIONS MIN TYP VR=3.3V 0.8 IR VR=10V BVR IR=100μA VF MAX 2.0 UNITS μA 1.3 7.0 μA IF=5.0μA 70 95 mV VF IF=10mA 300 370 mV CJ VR=0, f=1.0MHz 4.0 30 V pF R3 (5-January 2015) CTLSH01-30L SURFACE MOUNT SILICON LOW VF SCHOTTKY DIODE TLM2D3D6 CASE - MECHANICAL OUTLINE LEAD CODE: 1) Cathode 2) Anode MARKING CODE: D R3 (5-January 2015) w w w. c e n t r a l s e m i . c o m CTLSH01-30L SURFACE MOUNT SILICON LOW VF SCHOTTKY DIODE TYPICAL ELECTRICAL CHARACTERISTICS R3 (5-January 2015) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)